KURT J LESKER VACUUM SPUTTERING & METALIZING SYSTEM QUOTE# 76-85

Model/Type: Dual Chamber – CMS 18 series / 8" Dia Capacity New: 2010

General & Description of the LOT:

The lot includes the following items all related to the metalizing & sputtering

Components are available separately
•Dual chamber with load lock (3 cathodes in each chamber)
•PLC process control (programmable depositions)
•Substrates up to 8” diameter
•Substrate rotation (improved uniformity)
•Substrate bias, RF & DC (improved adhesion and density)
•Substrate heater, up to 500C (improved surface mobility)
•3” magnetron sputter cathodes (multiple materials without venting)
•RF & DC power supplies (DC for metals, RF for non-conducting materials)
•Co-sputter capability
Some notes on the system and it’s use:
The system was used as a sputter tool for the exploration of unique materials and thin film devices
The equipment remains in like new condition and has very low hours of actual use.
The system includes all targets, documentation, drawings and numerous spare parts

CONDITION: Excellent - in plant, set-up in a lab environment - under power, no longer in operation

LOCATIONCalifornia Plant, near LA

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